ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,306, issued on March 17, was assigned to Battelle Memorial Institute (Richland, Wash.). "Ion extraction and focusing from a field-free reg... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,311, issued on March 17, was assigned to Tonal Systems Inc. (San Francisco). "Collaborative exercise" was invented by David Azaria (San Fr... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,230, issued on March 17, was assigned to Axis AB (Lund, Sweden). "Method and device for monitoring of a heap of material" was invented by ... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,765, issued on March 17, was assigned to Beijing BOE Sensor Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "Ac... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,767, issued on March 17, was assigned to Capital One Services LLC (McLean, Va.). "Transmission of secure and authenticated data over a net... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,094, issued on March 17, was assigned to Prysmian S.p.A. (Milan). "Overhead conductors with high-temperature resistant cured coatings" was... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,352, issued on March 17, was assigned to SENSORVIEW Co. LTD. (South Korea) and OKINS ELECTRONICS Co. LTD. (South Korea). "Plug connector c... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,082, issued on March 17, was assigned to DOLBY VIDEO COMPRESSION LLC (San Francisco). "Context initialization in entropy coding" was inven... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,638, issued on March 17, was assigned to Seiko Epson Corp. (Tokyo). "Liquid ejecting head" was invented by Yoichi Naganuma (Matsumoto, Jap... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,599, issued on March 17, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packaging module, electronic device, and method... Read More